Cohen, Avram Bar: search on Z-Library

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1

[IEEE 2013 IEEE International Symposium on Phased Array Systems and Technology (ARRAY 2013) - Waltham, MA, USA (2013.10.15-2013.10.18)] 2013 IEEE International Symposium on Phased Array Systems and Technology - Advances in GaN technology and design for active arrays

Winslow, Thomas, Gross, Frank B., Weedon, William H., Johnson, Leonard, Carlson, Douglas J., Fenn, Alan J., Garneski, Dayel, Kryzak, Chuck, Rebeiz, Gabriel M., Bar-Cohen, Avram, Albrecht, John, Altman

Year:

2013

Language:

english

File:

PDF, 9.00 MB

english, 2013

2

Encyclopedia of Thermal Packaging (Set 2: Thermal Packaging Tools(A 4–Volume Set)) || Optimization Under Uncertainty for Electronics Cooling Design

Bar-Cohen, Avram

Year:

2014

Language:

english

File:

PDF, 7.68 MB

english, 2014

3

Two-Phase Liquid Cooling for Thermal Management of IGBT Power Electronic Module

Wang, Peng, McCluskey, Patrick, Bar-Cohen, Avram

Journal:

Journal of Electronic Packaging

Year:

2013

Language:

english

File:

PDF, 2.91 MB

english, 2013

4

Optimum Arrays of Longitudinal, Rectangular Fins in Corrective Heat Transfer

BAR-COHEN, AVRAM, JELINEK, MICHAEL

Journal:

Heat Transfer Engineering

Year:

1985

Language:

english

File:

PDF, 5.77 MB

english, 1985

5

Advances in Thermal Modeling of Electronic Components and Systems, Vol. 1

Bar-Cohen, Avram, Kraus, Allan D., Engel, Peter A.

Journal:

Journal of Electronic Packaging

Year:

1989

Language:

english

File:

PDF, 584 KB

english, 1989

6

Encyclopedia of Thermal Packaging (Set 2: Thermal Packaging Tools(A 4–Volume Set)) || Energy Efficient Solid-State Cooling for Hot Spot Removal

Bar-Cohen, Avram

Year:

2014

Language:

english

File:

PDF, 3.98 MB

english, 2014

7

Encyclopedia of Thermal Packaging (Set 2: Thermal Packaging Tools(A 4–Volume Set)) || Runtime Thermal Management Techniques

Bar-Cohen, Avram

Year:

2014

Language:

english

File:

PDF, 1.08 MB

english, 2014

8

Encyclopedia of Thermal Packaging (Set 2: Thermal Packaging Tools(A 4–Volume Set)) || Data Centers and Thermal Management Approaches

Bar-Cohen, Avram

Year:

2014

Language:

english

File:

PDF, 10.90 MB

english, 2014

9

Encyclopedia of Thermal Packaging (Set 2: Thermal Packaging Tools(A 4–Volume Set)) || A Review of Cooling Road Maps for 3D Chip Packages

Bar-Cohen, Avram

Year:

2014

Language:

english

File:

PDF, 3.81 MB

english, 2014

10

Encyclopedia of Thermal Packaging (Set 2: Thermal Packaging Tools(A 4–Volume Set)) || Dynamic Thermal Management Considering Accurate Temperature-Leakage Interdependency

Bar-Cohen, Avram

Year:

2014

Language:

english

File:

PDF, 271 KB

english, 2014

11

Encyclopedia of Thermal Packaging (Set 2: Thermal Packaging Tools(A 4–Volume Set)) || Energy Efficiency and Reliability Risk Mitigation of Data Centers Through Prognostics and Health Management

Bar-Cohen, Avram

Year:

2014

Language:

english

File:

PDF, 2.02 MB

english, 2014

12

SPIE Proceedings [SPIE SPIE Defense, Security, and Sensing - Baltimore, Maryland (Monday 23 April 2012)] Defense Transformation and Net-Centric Systems 2012 - Advanced thermal management technologies for defense electronics

Bloschock, Kristen P., Bar-Cohen, Avram, Suresh, Raja

Year:

2012

Language:

english

File:

PDF, 812 KB

english, 2012

13

Encyclopedia of Thermal Packaging (Set 2: Thermal Packaging Tools(A 4–Volume Set)) || Thermal Measurements and Their Use in Data Centers

Bar-Cohen, Avram

Year:

2014

Language:

english

File:

PDF, 4.17 MB

english, 2014

14

Encyclopedia of Thermal Packaging (Set 2: Thermal Packaging Tools(A 4–Volume Set)) || FRONT MATTER

Bar-Cohen, Avram

Year:

2014

Language:

english

File:

PDF, 680 KB

english, 2014

15

Encyclopedia of Thermal Packaging (Set 2: Thermal Packaging Tools(A 4–Volume Set)) || Thermally-Aware Design

Bar-Cohen, Avram

Year:

2014

Language:

english

File:

PDF, 1.96 MB

english, 2014

16

State-of-the-Art and Trends in the Thermal Packaging of Electronic Equipment

Bar-Cohen, Avram

Journal:

Journal of Electronic Packaging

Year:

1992

Language:

english

File:

PDF, 1.90 MB

english, 1992

17

Encyclopedia of Thermal Packaging (Set 2: Thermal Packaging Tools(A 4–Volume Set)) || Containment

Bar-Cohen, Avram

Year:

2014

Language:

english

File:

PDF, 27.36 MB

english, 2014

18

Encyclopedia of Thermal Packaging (Set 2: Thermal Packaging Tools(A 4–Volume Set)) || Optimal Choice of Heat Sinks from an Industrial Point of View

Bar-Cohen, Avram

Year:

2014

Language:

english

File:

PDF, 177 KB

english, 2014

19

Two-Phase Thermal Ground Planes: Technology Development and Parametric Results

Bar-Cohen, Avram, Matin, Kaiser, Jankowski, Nicholas, Sharar, Darin

Journal:

Journal of Electronic Packaging

Year:

2015

Language:

english

File:

PDF, 2.73 MB

english, 2015

20

Design of Optimum Plate-Fin Natural Convective Heat Sinks

Bar-Cohen, Avram, Iyengar, Madhusudan, Kraus, Allan D.

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 1.31 MB

english, 2003

21

Encyclopedia of Thermal Packaging (Set 2: Thermal Packaging Tools(A 4–Volume Set)) || FRONT MATTER

Bar-Cohen, Avram

Year:

2014

Language:

english

File:

PDF, 1.43 MB

english, 2014

22

Polymer Heat Exchangers—History, Opportunities, and Challenges

Cevallos, Juan Gabriel, Bergles, Arthur E., Bar-Cohen, Avram, Rodgers, Peter, Gupta, Satyandra K.

Journal:

Heat Transfer Engineering

Year:

2012

Language:

english

File:

PDF, 1.75 MB

english, 2012

23

Encyclopedia of Thermal Packaging (Set 2: Thermal Packaging Tools(A 4–Volume Set)) || An Overview of the Use of Phase Change Materials for the Thermal Management of Transient Portable Electronics: Benefits and Challenges

Bar-Cohen, Avram

Year:

2014

Language:

english

File:

PDF, 1.68 MB

english, 2014

24

Encyclopedia of Thermal Packaging (Set 2: Thermal Packaging Tools(A 4–Volume Set)) || Hydrophilic CNT-Sintered Copper Composite Wick for Enhanced Cooling

Bar-Cohen, Avram

Year:

2014

Language:

english

File:

PDF, 3.05 MB

english, 2014

25

Encyclopedia of Thermal Packaging (Set 2: Thermal Packaging Tools(A 4–Volume Set)) || Towards Embedded Cooling - Gen 3 Thermal Packaging Technology

Bar-Cohen, Avram

Year:

2014

Language:

english

File:

PDF, 12.35 MB

english, 2014

26

Orthotropic thermal conductivity effect on cylindrical pin fin heat transfer

Raj Bahadur, Avram Bar-Cohen

Journal:

International Journal of Heat and Mass Transfer

Year:

2007

Language:

english

File:

PDF, 473 KB

english, 2007

27

Encyclopedia of Thermal Packaging (Set 2: Thermal Packaging Tools(A 4–Volume Set)) || Dynamic Thermal Modeling of Data Centers

Bar-Cohen, Avram

Year:

2014

Language:

english

File:

PDF, 30.60 MB

english, 2014

28

Encyclopedia of Thermal Packaging (Set 2: Thermal Packaging Tools(A 4–Volume Set)) || Ongoing Efforts

Bar-Cohen, Avram

Year:

2014

Language:

english

File:

PDF, 661 KB

english, 2014

29

Encyclopedia of Thermal Packaging (Set 2: Thermal Packaging Tools(A 4–Volume Set)) || Recent Advance in Thermoelectric Devices for Electronics Cooling

Bar-Cohen, Avram

Year:

2014

Language:

english

File:

PDF, 4.27 MB

english, 2014

30

Encyclopedia of Thermal Packaging (Set 2: Thermal Packaging Tools(A 4–Volume Set)) || BACK MATTER

Bar-Cohen, Avram

Year:

2014

File:

PDF, 1.13 MB

2014

31

Encyclopedia of Thermal Packaging (Set 2: Thermal Packaging Tools(A 4–Volume Set)) || Estimation of Cooling Performance of Phase Change Material (PCM) Module

Bar-Cohen, Avram

Year:

2014

Language:

english

File:

PDF, 763 KB

english, 2014

32

Encyclopedia of Thermal Packaging (Set 2: Thermal Packaging Tools(A 4–Volume Set)) || Theoretical Framework of Compact Thermal Models — Steady Problems

Bar-Cohen, Avram

Year:

2014

Language:

english

File:

PDF, 211 KB

english, 2014

33

Encyclopedia of Thermal Packaging (Set 2: Thermal Packaging Tools(A 4–Volume Set)) || BACK MATTER

Bar-Cohen, Avram

Year:

2014

Language:

english

File:

PDF, 1.03 MB

english, 2014

34

Encyclopedia of Thermal Packaging (Set 2: Thermal Packaging Tools(A 4–Volume Set)) || A Cabinet Level Thermal Test Vehicle to Evaluate Hybrid Double-Sided Cooling Schemes

Bar-Cohen, Avram

Year:

2014

Language:

english

File:

PDF, 4.28 MB

english, 2014

35

Encyclopedia of Thermal Packaging (Set 2: Thermal Packaging Tools(A 4–Volume Set)) || Damage Pre-Cursors Based Assessment of Accrued Thermo-Mechanical Damage and Remaining Useful Life in Field Deployed Electronics

Bar-Cohen, Avram

Year:

2014

Language:

english

File:

PDF, 11.32 MB

english, 2014

36

Thermal Management of On-Chip Hot Spot

Bar-Cohen, Avram, Wang, Peng

Journal:

Journal of Heat Transfer

Year:

2012

Language:

english

File:

PDF, 4.28 MB

english, 2012

37

Encyclopedia of Thermal Packaging (Set 2: Thermal Packaging Tools(A 4–Volume Set)) || Multi-scale Modeling of Electronics Cabinets

Bar-Cohen, Avram

Year:

2014

Language:

english

File:

PDF, 11.25 MB

english, 2014

38

Encyclopedia of Thermal Packaging (Set 2: Thermal Packaging Tools(A 4–Volume Set)) || Thermal Performance Mapping of Direct Liquid Cooled 3D Chip Stacks

Bar-Cohen, Avram

Year:

2014

Language:

english

File:

PDF, 435 KB

english, 2014

39

Encyclopedia of Thermal Packaging (Set 2: Thermal Packaging Tools(A 4–Volume Set)) || Synthetic Jets for Heat Transfer Augmentation in Microelectronics Systems

Bar-Cohen, Avram

Year:

2014

Language:

english

File:

PDF, 2.78 MB

english, 2014

40

Encyclopedia of Thermal Packaging (Set 2: Thermal Packaging Tools(A 4–Volume Set)) || Energy Reduction and Performance Maximization Through Improved Cooling

Bar-Cohen, Avram

Year:

2014

Language:

english

File:

PDF, 1.10 MB

english, 2014

41

Encyclopedia of Thermal Packaging (Set 2: Thermal Packaging Tools(A 4–Volume Set)) || Thermal Modeling of Data Centers

Bar-Cohen, Avram

Year:

2014

Language:

english

File:

PDF, 21.27 MB

english, 2014

42

Exponentially varying internal heat generation in fully-developed, laminar, rectangular channel flow

Avram Bar-Cohen

Journal:

International Journal of Heat and Mass Transfer

Year:

1981

Language:

english

File:

PDF, 266 KB

english, 1981

43

[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems - Anticipatory Thermoelectric Cooling of a Transient Germanium Hotspot

Manno, Michael, Wang, Peng, Bar-Cohen, Avram

Year:

2013

Language:

english

File:

PDF, 1.91 MB

english, 2013

44

Enhancement of pool boiling critical heat flux in dielectric liquids by microporous coatings

Mehmet Arik, Avram Bar-Cohen, Seung Mun You

Journal:

International Journal of Heat and Mass Transfer

Year:

2007

Language:

english

File:

PDF, 503 KB

english, 2007

45

Thermal performance of a polymer composite webbed-tube heat exchanger

Cevallos, Juan, Bar-Cohen, Avram, Deisenroth, David C.

Journal:

International Journal of Heat and Mass Transfer

Year:

2016

Language:

english

File:

PDF, 2.25 MB

english, 2016

46

Encyclopedia of Thermal Packaging (Set 2: Thermal Packaging Tools(A 4–Volume Set)) || Star-Shaped Compact Models Including 2R Models

Bar-Cohen, Avram

Year:

2014

Language:

english

File:

PDF, 329 KB

english, 2014

47

“Heat Shield”—An Enhancement Device for an Unshrouded, Forced Convection Heat Sink

Prstic, Suzana, Bar-Cohen, Avram

Journal:

Journal of Electronic Packaging

Year:

2006

Language:

english

File:

PDF, 668 KB

english, 2006

48

Review of heat exchangers enabled by polymer and polymer composite additive manufacturing

Deisenroth, David C., Moradi, Ramin, Shooshtari, Amir H., Singer, Farah, Bar-Cohen, Avram, Ohadi, Michael

Journal:

Heat Transfer Engineering

Year:

2017

Language:

english

File:

PDF, 1.54 MB

english, 2017

49

On-chip hot spot cooling using silicon thermoelectric microcoolers

Wang, Peng, Bar-Cohen, Avram

Journal:

Journal of Applied Physics

Year:

2007

Language:

english

File:

PDF, 1.52 MB

english, 2007

50

Mini-Contact Enhanced Thermoelectric Cooling of Hot Spots in High Power Devices

Yang, Bao, Wang, Peng, Bar-Cohen, Avram

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2007

Language:

english

File:

PDF, 490 KB

english, 2007

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